2018 4th International Conference on Mechanical Structures and Smart Materials (4th ICMSSM2018) is sponsored by X-academy.And the conference will be held on September 22-23, 2018 in Shenzhen, China.
The aim of ICMSSM2018 is to provide a platform for researchers, engineers, and academicians, as well as industrial professionals, to present their research results and development activities in Mechanical Structures and Smart Materials Related Issue. This conference provides opportunities for the delegates to exchange new ideas and application experiences, to establish business or research relations and to find global partners for future collaboration.
The 1st International Conference on Mechanical Structures and Smart Materials (1st ICMSSM2013) has been successfully held in Xiamen, China during November 16-17th,2013.The 2nd International Conference on Mechanical Structures and Smart Materials (2nd ICMSSM2014) has been successfully held in Kuala Lumpur, Malaysia during August 16-17th, 2014. The 3rd International Conference on Mechanical Structures and Smart Materials (3rd ICMSSM2016) has been successfully held in Nanjing, China during October 22-23, 2016.
Papers submitted to ICMSSM2018 will be reviewed by technical committees of the conference. All accepted and registered papers will be published in "Materials Science Forum" [ISSN print 0255-5476 ISSN cd 1662-9760 ISSN web 1662-9752, Trans Tech Publications]. And the press will submit all papers to major databases such as EI Compendex, Scopus and Scholar...
We sincerely invite you to join ICMSSM2018, and welcome your submitting.
Please note: The conference organizer will arrange the paper to be published as schedule. And the press will submit all papers to major databases. But we can't promise any index services because the index service company has the final right to decided if the paper would be indexed.
Photo of 1st ICMSSM2013 (Xiamen, China),please click .
Photo of 2nd ICMSSM2014 (Kuala Lumpur, Malaysia),please click.
Photo of 3rd ICMSSM2016 (Nanjing, China),please click.