Home News FAQ Download Contact
 
2013 International Conference
on Mechanical Structures
and Smart Materials
 
November .16-17,2013
Xiamen,China
 
   
  Sidebar Menu
  Home
  CFP
  Committee
  Publication
  Submission
  Deadline
  Registration
  Keynote
  Journal
  Venue
  Contact
  中文说明
 
Sponsors
Journal

The committee of the ICMSSM2013 will recommend 20 excellent papers to The Open Mechanical Engineering Journal and will be published as a special issue of ICMSSM.

Aims & Scope

The Open Mechanical Engineering Journal is an open access online journal, which publishes research articles, reviews, letters and guest edited single topic issues, in all areas of mechanical engineering.

The Open Mechanical Engineering Journal, a peer-reviewed journal, is an important and reliable source of current information on developments in the field. The emphasis will be on publishing quality papers rapidly and freely available to researchers worldwide.

Topic(with particular focus on the following, but not limited to them):

T1: Product and Materials Engineering

T2: Noise Abatement and Control

T3: Mechanics of Solid Materials

T4: Fluid Mechanics

T5: Mechanics related topics

Submission

If you want to your paper to be recommended to The Open Mechanical Engineering Journal, please fill with the covering letter and journal recommended form attached with your paper to si.cfp@icmssm.org before October.19,2013 and prepare your paper as the instruction.

Important date:

Paper Submission: Oct.31, 2013
Notification of Acceptance: Nov.5,2013
Authors' Registration: Nov.11, 2013

Covering letter

Journal recommended form

paper instruction for tomej:http://www.benthamscience.com/open/tomej/MSandI.htm

Contact

Email: si.cfp@icmssm.org

Tel: +86-24-83958379-801

特刊征稿中文说明

2013年机械结构与智能材料国际会议(ICMSSM 2013)将于2013年11月16-17日在中国厦门夏商.怡翔酒店(华都店)举行。此次国际会议是由Trans tech publications主办,沈阳博思教育咨询有限公司承办的机械结构与智能材料领域的学术盛会。此次国际会议旨在推动我国机械结构与智能材料领域与世界的交流与合作。

ICMSSM2013 也得到了EI检索(JA)国际期刊The Open Mechanical Engineering Journal(TOMEJ)[ISSN:1874-155X]的支持,TOMEJ将为ICMSSM2013 出版特刊,录用约20篇文章,所有录用的文章都将出版到TOMEJ期刊。

1、文章主题:

Topic(with particular focus on the following, but not limited to them):

T1: Product and Materials Engineering

T2: Noise Abatement and Control

T3: Mechanics of Solid Materials

T4: Fluid Mechanics

T5: Mechanics related topics

(文章主题可以不局限于如上主题,只要符合TOMEJ期刊主题即可,详细的征稿主题可以参见会议网站http://www.icmssm.org/sci.html

2、征稿要求:

a.期刊官方语言英文,文章正文部分双栏排版,页数必须在6-8页之间;

b. TOMEJ期刊模板,请见http://www.benthamscience.com/open/tomej/MSandI.htm ;

c.请将文章连同covering letterjournal recommended form一并发送至期刊征稿邮箱si.cfp@icmssm.org (注:此邮箱仅用于TOMEJ投稿使用,如需会议投稿,请投递至cfp@icmssm.org)

3、征稿时间:

截稿时间:2013年10月31日

录用时间:2013年11月5日

注册截止时间:2013年11月11日

4、会务组联系方式:

Email:si.cfp@icmssm.org

Tel: 024-83958379-801

Web: http://www.icmssm.org/sci.html

 
   
   
 
 
@Copyright ICMSSM2013